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Heat Staking - Know How 1
The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.
Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.
The heat required for the process is introduced into the plastic via pulse-heated dies.
Under the action of the necessary application force, the components are positively and firmly bonded.
The die(s) are moved to the product via a pneumatic shaft and the necessary process force is generated via spring elements.
According to the application, the heating of the die takes place before or during the contact with the product. |
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Surface Emitters (All)
