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Application 22

A metal sheet is fixed by the heat staking process at several positions in a plastic housing. The plastic is standard unfilled plastic (ABS). The dome measuring about 2 mm in diameter.

Heat Staking - Application 22
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Application 1

Heat staking application for fixing an LCD display in a plastic body.

Two shaped heating dies are moved to plastic edges and formed on the product.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 1
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Application 2

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 2
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Application 3

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 3
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Application 4

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 4
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Application 5

Heat staking application for fixing a circuit board in a plastic body.

The circuit board is located in an injection moulding part with prepared parts.

The plastic domes fed through the circuit board are formed into a rivet by the die, so that the circuit board is fixed in the plastic part.

Thermoplastic materials such as PA, PP, PBT, POM, PC and PE (also with glass fibre content) are caulked.

Heat Staking - Application 5
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Beispiel

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